Incorporating an alternative acid catalyst, F2 provides a lower compressibility option to Symmetry with smaller median pore size; resulting in improved cleaning efficiency for more challenging FEoL hydrophobic films and layers (STI, SiN and poly-Si).

Formulated with cleaner raw materials to meet the growing demands of BEoL interconnect materials (Cu, Co, Ru), Eclipse provides the lowest commercially available compressive stress, preferred electrokinetic properties, and  lowest level of both releasable and trace metal contamination.

Utilizing the same clean raw material package as Eclipse, Eclipse HCS has been reformulated to provide a higher compressive stress which delivers a more mechanical clean required for increasing numbers of ≤10nm FEoL/MoL (RMG) semiconductor layers with challenging and critical cleaning requirements.

Highly durable formulation used for critical cleaning applications that extend across many market segments including semiconductor, data storage, and MEMs.